• Denna rapport ger presentation inblick i den mest omfattande sätt. Rapporten strukturen har hållits till en sådan grad att det ger störst affärskänsla. Det ger grundläggande bitar av kunskap till marknaden element och kommer att ge viktiga grundläggande ledarskap för den aktuella marknadsaktörerna precis som dem som är redo att träda in på marknaden.

  • The instruction of PCB

  • While the PCB is heated, part of the free volume of water can be dissipated through the microporous PCB substrate, thereby reducing the molar volume fraction of water that may accumulate at the voids or microcracks, which is beneficial to the explosion of the PCB. improve. However, if the surface of the PCB has a large area of copper foil pattern coverage, when the PCB is heated, the large copper foil surface above the buried hole blocks the water vapor that escapes outward after being heated, so that the pressure of water vapor in the microcrack increases, resulting in occurrence of The chance of a burst is greatly increased.

  • As the temperature continues to rise, the gas accumulated in the vicinity of the buried hole is more and more, forming a large expansion pressure, so that the browning surface of L2 and the PP are subjected to a separation force for separating them.When the final expansion pressure (f) is less than the adsorption force (F) between the browning surface and the PP (fF), separation occurs between the browning surface of L2 and PP. A distinct blocky blistering phenomenon.

  • In the following, the existence of water in the PCB, the way of water vapor diffusion and the change of water vapor pressure with temperature, reveal that the existence of water vapor is the primary cause of PCB explosion.

  • Children admire automatons at the opening of the World Robot Conference in Beijing's Daxing district on Tuesday. The event, themed "Intelligent ecosystem for a new open era", runs through Sunday. [Photo by Wang Jing/China Daily]

  • Obviously, the sufficient and necessary conditions for the latent burst must be induced by the temperature factor. Optimizing the reflow soldering temperature profile based on a comprehensive analysis of specific product characteristics is effective in suppressing the occurrence of cracking

  • Therefore, the soldering reliability of PCBA becomes more and more important. The followings are studied by Inspi​, and describes the shortage of the blasting plate in reflow soldering and its improvement method for your reference.

  • Chinese smartphone manufacturer Nubia Technology Co Ltd is bringing its innovative dual-screen technology to the flagship line of smartphones with the launch of Nubia Z20.Good news that Inpsi it also provide the service on manufacturing smart phone pcb assembly.

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